MIT Department of Electrical Engineering & Computer Science

E E C S

On the Universality of the Electron Mobility and Degradation of the Total Gate Capacitance in Scaled Silicon MOSFETs

Dragica Vasileska
Arizona State University

Wednesday, March 26, 1997
4:00 PM (3:45 refreshments)
Grier Room, Room 34-401A
EECS Special Seminar

Abstract

As MOSFETs are scaled to deep-submicron channel lengths, it has become necessary to decrease the oxide thickness (to less than 10 nm) and to increase the channel doping (Na=5x10^17 cm^-3 or more) in order to continue to maintain good control of the channel by the gate. The high substrate doping leads to large surface electric fields and significant quantization of the carriers in the direction perpendicular to the interface, even near the threshold of inversion. The non-uniformity of the doping profile used in these state-of-the art devices affects the magnitude of the weighting coefficients for the inversion and depletion charge densities in the definition of the effective transverse electric field used in obtaining the universal mobility curves. This talk will present the results of some recent theoretical studies, in which we have addressed some of the above issues, including:
  1. The degradation of the total gate capacitance (which determines MOSFETs transconductance) due to finite inversion layer capacitance;
  2. The influence that depletion charge and surface-roughness scattering have on the low-field mobility in scaled Si MOSFETs; and
  3. Calculation of the appropriate weighting coefficients for the inversion and depletion charge densities in the definition of Eeff that lead to the universal mobility curves for devices with uniform, step-like and retrograde doping profiles.


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Created: Mar 11, 1997  | Modified: Jun 24, 1997
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